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promising candidates for this goal, combining fast electrical control, compact device geometry, and excellent performance in a semiconductor platform. As this technology advances, one of the main remaining
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deployed through conventional casting for standard applications and through 3D printing for complex or non-planar geometries. In parallel, circular end-of-life strategies will recover fibres, upcycle fines
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structural interventions. It can be deployed through conventional casting for standard applications and through 3D printing for complex or non-planar geometries. In parallel, circular end-of-life strategies
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