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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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force microscopy, magnetic and dielectric characterization, oxide thin-film growth, and close collaboration with leading theoretical groups. We pursue fundamental experimental research while maintaining a
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