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engineering, or a closely related field, in hand by the date of appointment. ● Research experience performing first-principles electronic structure or density functional theory calculations using
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: ● Power module packaging and integration. ● High-density power converter design/prototyping, topology/loss analysis (including magnetic losses), thermal/EMI analysis. ● EMI emission and filter
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: ● Power module packaging and integration. ● High-density power converter design/prototyping, topology/loss analysis (including magnetic losses), thermal/EMI analysis. ● EMI emission and filter
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