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photonic devices, including die attach, solder reflow, wire bonding, solder bumping and other related packaging processes. Set up, program, and operate semi-automated equipment for process development and
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, including die attach, solder reflow, wire bonding, solder bumping and other related packaging processes. Set up, program, and operate semi-automated equipment for process development and prototyping. Support
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integrated circuits (ICs) for advanced imaging and edge computing applications, exploring novel approaches to integrating sensing and pixel-level processing. The research involves full-custom chip design using
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28 Sep 2026 Job Information Organisation/Company UNIVERSIDAD POLITECNICA DE MADRID Department HRS4R Research Field Engineering » Electronic engineering Researcher Profile First Stage Researcher (R1
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2 Oct 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Biological sciences » Biological engineering Biological sciences » Biology Computer
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Civil Engineering, Mechanical, Electrical, or a closely related field. Demonstrated expertise in ESM and IAM. Experience with High Performance Computing (HPC) and large-scale dataset analysis. Strong
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23 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Computer science » Programming Engineering » Electrical engineering Engineering » Mechanical
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platforms. Advanced Computational Biology & Software Engineering: Learning how to develop computational biology software using both traditional coding suites and emerging AI/Large Language Model (LLM) tools
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Degree in Information and Technology Services, Higher Education environment, or a related field Three (3) years of experience in Computer and Information Technology, Computer Science, or related field and
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-savings-program/ Tuition reimbursement: https://employees.usc.edu/tuition-benefits/ Paid Time Off (PTO) including, up to 24 vacation days (based on tenure), 12 sick days, 9 paid holidays, 1 paid personal