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Please submit the following documents with your nomination: Application form with details of the nominees and the nominator A title (max. 150 characters) and a brief summary of the achievement (max. 400 characters) A description of the achievement and the main results (max. 4’000...
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Posting Details Position Details Title Postdoc in Real-Time Data Analysis with LHCb at Indiana University Appointment Status Non-Tenure Track Department IU Bloomington Physics Location Bloomington
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07.07.2026, Academic staff Join us to push the state of the art in formal verification and reachability analysis for discrete-space systems. Your research will focus on the applications of logical zonotopes in digital circuits and the model checking of discrete-space systems, with the goal of...
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must be presented by the start date, otherwise the offer may be withdrawn. What we offer As a postdoc at Chalmers, you are an employee and enjoy all employee benefits. Read more about working at
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The Freie Universität Berlin invites applications for a research assistant position (Postdoc) (f/m/d) at the Cluster of Excellence SCRIPTS (Contestations of the Liberal Script). The Cluster
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Position Description The STELLAR lab (https://sites.google.com/view/thestellarlabgenoa/ ) of the Department of Physics at the University of Genoa invites applications for one postdoctoral research position (initial 2-year contracts, with potential extension for a further 2 years subject to...
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Position Description HETAO INSTITUTE OF MATHEMATICS AND INTERDISCIPLINARY SCIENCES (HIMIS) invites applications for postdoc positions from accomplished scholars in all fields of mathematics
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Job description The Challenge As process industries transition to circular models, companies within Hubs for Circularity (H4C) need robust tools to navigate the financial complexities of industrial symbiosis. This project aims to bridge financial modelling, AI, simulation, and circular business...
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Vacancies Postdoc in Sustainable Circular Business Models and Finance in Hubs for Circularity Key takeaways The Challenge As process industries transition to circular models, companies within Hubs
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked