Sort by
Refine Your Search
-
Listed
-
Category
-
Country
-
Program
-
Field
-
Details Title Postdoctoral Fellow – PKPD Modelling, Lung-on-Chip School Wyss Institute for Biologically Inspired Engineering Department/Area Position Description About the Wyss: The Wyss Institute’s
-
packaging engineers will work on the establishment of the Assembly Design Kit (ADK) of optical and electrical elements. Most of the work will be focusing on optical fibre integration into PIC, chip
-
Aragon Institute for Engineering Research (I3A) | Zaragoza, Coahuila de Zaragoza | Mexico | 24 days ago
functional screening in advanced human in vitro models, including heart-on-chip platforms. The research will be conducted at the Aragón Institute of Engineering Research (I3A) at the University of
-
and AI/ML workflows, to join an interdisciplinary team of biologists and engineers to leverage in vitro organ-on-a-chip (Organ Chip) microfluidic culture systems and injectable formulations to study
-
Delft University of Technology (TU Delft) | Delft, Provincie Zuid-Holland | Netherlands | about 1 month ago
use microfluidics for cancer research? Are you passionate to develop ogran-on-a-chip for drug screening applications? Would you thrive in a high-end, interdisciplinary research environment dedicated to
-
and AI/ML workflows, to join an interdisciplinary team of biologists and engineers to leverage in vitro organ-on-a-chip (Organ Chip) microfluidic culture systems and injectable formulations to study
-
additional datasets (RNA-seq, ChIP-seq, ATAC-seq, protein interactome, etc.) to investigate the impact of lamin mutations on spatial genome organization in lipodystrophy patient-derived cells. You will
-
Università degli Studi di Roma Tor Vergata - Dipartimento di Biomedicina e Prevenzione | Roma, Lazio | Italy | 2 months ago
versus CHRS; (3) establishment of the first Italian CHIP/CCUS clinic with a PDTA and tiered surveillance triggered by molecular signals (new non‑DTA drivers ≥2%, significant ΔVAF, −7/7q−). Objectives
-
bonding performance for next-generation 3D chip integration. Where to apply Website https://www.academictransfer.com/en/jobs/364047/postdoc-position-on-wafer-bondi… Requirements Specific Requirements You
-
for biomedical applications. The candidate will contribute to the optimization of such sensors by addressing the problem of distributing time-critical signals over a wide chip area by developing