Sort by
Refine Your Search
-
Category
-
Country
-
Employer
-
Field
-
. The Research Fellow is expected to support cryogenic packaging and system-level integration, including fiber-array coupling, electrical interconnects, compact packaging of detector chips, low-noise readout
-
changes in spring melt onset timing. The PhD position will have three interconnected objectives: 1) Detect and characterize ROS events and their impact on snow/sea ice physical system using reanalysis
-
We are seeking a highly motivated Postdoctoral Research Associate (PDRA) to join the MIMIC programme: “An interconnected multi‑organ platform to recreate the complex pathophysiology of Metabolic
-
related to staff position within a Research Infrastructure? No Offer Description We are seeking a highly motivated Postdoctoral Research Associate (PDRA) to join the MIMIC programme: “An interconnected
-
, addressing power integrity, thermal management, and chip–package interaction challenges. c. Supervise and mentor junior researchers and graduate students working on BS-PDN design, modeling, and advanced
-
low-temperature Cu/dielectric hybrid bonding for fine-pitch, high-density interconnects by developing and validating a new flow with reliable dielectric sealing under ≤200 °C. The role integrates materials
-
, EME, and photonic-circuit simulators (e.g., Lumerical, Tidy3D, INTERCONNECT). Develop, fabricate, and characterise hybrid III–V/TFLN and III–V/Si₃N₄ semiconductor lasers — including E-DBR Pockels FM
-
the behavioral, social, economic, and innovation dimensions of vertical farming adoption. The research program will focus on the following interconnected themes. Research Theme 1: Social Acceptance of Vertical
-
interconnected themes. Research Theme 1: Social Acceptance of Vertical Farming The candidate will investigate: Public perceptions of vertical farming technologies. Consumer trust and confidence in controlled
-
-generation semiconductor technologies. The programme’s four interconnected semiconductor research areas are: Advanced compound materials and heterostructures Novel architectures Chip design Advanced packaging