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University of North Carolina at Chapel Hill | Chapel Hill, North Carolina | United States | about 1 hour ago
Posting Information Posting Details Department Physics and Astronomy - 319000 Posting Open Date 09/25/2026 Application Deadline 03/23/2027 Open Until Filled No Position Type Postdoctoral Scholar
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the internal application process. Welcome to The Ohio State University's career site. We invite you to apply to positions of interest. In order to ensure your application is complete, you must complete
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at Chalmers University of Technology conducts interdisciplinary research at the interface of physics, nanoscience, and biology. Our research spans biomolecular physics, nanophotonics, and light–matter
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26 Sep 2026 Job Information Organisation/Company National Institute for Materials Science Department Research Center for Electronic and Optical Materials Research Field Technology Physics Chemistry
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modelling. About You Applicants should possess or be close to obtaining a PhD in physics, chemistry, materials science or engineering. They should be highly versed in materials synthesis and characterisation
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: Safeguarding Users’ Cognitive Autonomy in Human-AI Interaction Cognitive autonomy, our fundamental ability to think independently, is under threat from growing reliance on artificial intelligence (AI) technology
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Full time, fixed term for 1.5 years Apply your expertise in electrochemical device development and chemical process design to advance sustainable technologies Base Salary $113,634 - $125,896 + 17
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23 Sep 2026 Job Information Organisation/Company Uppsala universitet Department Uppsala University, Disciplinary Domain of Science and Technology, Faculty of Physics, Department of Physics and
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the internal application process. Welcome to The Ohio State University's career site. We invite you to apply to positions of interest. In order to ensure your application is complete, you must complete
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked