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, the School graduates over a thousand students who are ready to take on great ambitions and challenges. For more details, please view: https://www.ntu.edu.sg/eee We are looking for a Research Fellow
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, the School graduates over a thousand students who are ready to take on great ambitions and challenges. For more details, please view: https://www.ntu.edu.sg/eee We are hiring a Research Fellow in IC
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Eindhoven University of Technology (TU/e) | Eindhoven, Provincie Noord-Brabant | Netherlands | about 1 month ago
improving performance in wired/wireless communications and advanced sensing, is pushing the integration of analog/RF/mm-wave and mixed-signal systems. In these domains, energy-efficient wideband signal
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devices and systems; FPGA firmware design. Contact: Massimo Gottardi (FBK), Giampietro Tecchiolli (AI4IV) Where to apply Website https://phd.fbk.eu/calls/detail/mixed-analog-digital-cmos-architectures-for
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Doctoral Researcher in Hardware-Aware AI for Analog and RF Circuits Employer AALTO UNIVERSITY Location Finland (FI) Salary 3100€/Month Closing date 9 Oct 2026 View more categories View less
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and instruments; the largest clean rooms in the Nordic countries are located in the Micro- and nanotechnology centre Micronova. Doctoral Researcher in Hardware-Aware AI for Analog and RF Circuits. We
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, that after validation, will be embedded into dedicated system for functional tests. Through collaboration with experts in image sensors, analog and digital circuit design, the student will develop
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activities. Manage and maintain a wide range of electronic test/repair equipment including (but not limited to): PACE rework stations, Mantis Microscopes, Analog/digital oscilloscopes, bench power supplies
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imaging, including conducting semiconductor sensor fabrication, modeling and characterization; analog, digital and/or mixed-signal circuit design; development of other readout hardware, firmware and
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Multiple Tenure-Track Assistant Professor Positions in Microelectronics, Circuits and Systems Design
can teach and lead research in one or more of the following areas: analog and mixed-signal integrated circuits; digital VLSI and AI hardware systems; advanced packaging and heterogeneous integration