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for high-aspect-ratio vertical interconnects characterise the results (SEM, AFM, XCT, optical microscopy) for geometric accuracy, durability and interfacial strength -validate scalability and
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interconnects characterise the results (SEM, AFM, XCT, optical microscopy) for geometric accuracy, durability and interfacial strength -validate scalability and sustainability: less material waste, better energy
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and biosensors using microscopic techniques. Measure properties with force spectroscopy. Apply magnetic force microscopy (MFM). Use Kelvin probe force microscopy (KPFM). Execute AFM assays in liquid
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fabricated devices using techniques such as SEM, AFM and other metrology tools Collaborate with multidisciplinary teams on device development, fabrication workflows, and process integration Contribute
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as well as MSc and PhD programmes. Further information may be found at: http://www.kcl.ac.uk/physics About the role: We are seeking a highly motivated and experienced researcher, holding a PhD in
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School graduates over a thousand students who are ready to take on great ambitions and challenges. For more details, please view: https://www.ntu.edu.sg/eee We are looking for a Research Fellow to lead and
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. Establish a nanomechanical and macro textural foundation for small sample cultivated meat using advanced tools such as AFM, micro-indentation, and micro texture analysers (e.g., TA.XT plus), Confocal Laser
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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | 22 days ago
candidate with strong cleanroom fabrication tool experience, particularly in materials characterization methods such as ellipsometry, AFM, SEM, TEM, XRD, SIMS, or related techniques. Experience with
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electronic transport directly with structural and nanoscale characterization, including TEM, AFM and nanoARPES. The project combines hands-on device fabrication with advanced measurements and close
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of nanoscale devices, preferably using atomically thin materials; their characterisation; photolithography and e-beam lithography; thin-film deposition; wet and reactive ion etching; SEM and AFM characterisation