Semiconductor Packaging Engineer

Virginia Alliance for Semiconductor Technology (VAST) is a Commonwealth of Virginia initiative to innovate Virginia’s semiconductor, microelectronics, and nanotechnology ecosystem. VAST is an alliance of institutions of higher education to coordinate the semiconductor and nanofabrication cleanrooms, nano-characterization facilities, and advanced packaging and microelectronics centers across member institutions; to accelerate the development of a qualified workforce through a new Fast Track to Semiconductor Career program; and to market and promote the assets and infrastructure that supports the industry in the Commonwealth. VAST website will serve as the gateway to semiconductor and nanotechnology excellence in the Commonwealth. The VAST Headquarters will be at Virginia Tech Research Center (VTRC) in Arlington and founding members of the alliance are George Mason University (GMU), Virginia Tech (VT), University of Virginia (UVA), Virginia Commonwealth University (VCU), Norfolk State University (NSU). Each member may have more than one cleanroom or facility that participates in the network. Northern Virginia Community College will be a strategic partner for the workforce development and the Fast Track to Semiconductor Career programs.

VAST is looking for a qualified engineer for the Semiconductor Packaging and Characterization Certification. The certificate program, part of the VAST Fast Track to Semiconductor Careers, will consist of synchronous and asynchronous online lectures, daily office hours, and about 5 hours of hands-on training per week. Fast Track to Semiconductor Careers initiative is aimed at reskilling and upskilling military veterans and adult learners for the semiconductor and electronics industry sector by teaching them the principles of semiconductor packaging. The VAST Semiconductor Packaging Engineer will:

- Conduct hands-on training in the following areas: package materials and fabrication processes, package characterization and testing, electrical package design, thermal package design, and package reliability.
- Design and develop process flows for substrate patterning, solder reflow, die bonding, wire bonding, shear and pull testing, and thermal cycling. Testing equipment may include curve tracer, impedance analyzer, network analyzer, and thermal analyzer.
- Teach the program participants to use relevant design and simulation tools, packaging and characterization equipment, and design a semiconductor packaging project.
- Ensure proper and safe equipment usage, and proper handling and disposal of materials and chemicals.
- Gather information and prepare reports as instructed related to the use of the facilities and workforce training programs.
- Work closely with faculty, students, and staff at partner universities to meet the needs and goals set by the VAST leadership team.
- Travel between Blacksburg, VA and Arlington, VA, as needed to perform assigned tasks within the semiconductor packaging facilities.
- Generate and provide data as needed to be integrated within the VAST cloud-based facilities management system.
- Work with core groups to create an inventory of semiconductor and nanotechnology tools and equipment within the VAST nodes and beyond in the Commonwealth of Virginia