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meaningful insights that support resilient and sustainable energy futures. The team This role will report to Associate Professor Dr Ruidong Chang and sit within the School of Civil Engineering and Construction
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-enabled approaches to understand atomic-scale structures, defects and structure-property relationships in advanced materials, contributing to next-generation materials discovery. The successful candidate
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interfacial reaction mechanisms demonstrated proficiency in DFT and at least one major electronic-structure package (for example VASP, Quantum ESPRESSO, CP2K, GPAW or equivalent) strong Python, ASE, Linux/HPC
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electrical, electromagnetic and materials characterisation of 3D- and 4D-printed materials and structures relevant to microwave applications. Perform hands-on fabrication, integration and experimental testing
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staff to supervise research and teaching, 51 fixed term staff and postdocs, 97 postgraduate students and 2,288 equivalent full-time student-load undergraduate students. To learn more about the School
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of fabrication processes. Conduct electrical, electromagnetic and materials characterisation of 3D- and 4D-printed materials and structures relevant to microwave applications. Perform hands-on fabrication
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of senior academic staff, and they will assist in the development and management of research activities that use structural and functional magnetic resonance imaging and positron emission tomography
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reduction for data with complex structures, including but not limited to, multi-way clustered, spatial-temporal, and network dependence. The successful applicant will be jointly supervised by CIs Linh Nghiem
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of previous employment or in a legal process. Similarly, your ongoing employment is conditional upon the satisfactory maintenance of all relevant clearances and background check requirements. If you do not meet
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or gender-based violence in the course of previous employment or in a legal process. Similarly, your ongoing employment is conditional upon the satisfactory maintenance of all relevant clearances and