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Field
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modelling to support device design and interpretation of experimental results, using COMSOL, ANSYS Fluent or equivalent tools. Process simulation or techno-economic assessment using Aspen Plus, Aspen HYSYS
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Responsibilities Lead photonic integrated circuit (PIC) design and simulation using commercial tools. Contribute to novel photonic computing architectures including optical in-memory and
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decision-analytic simulation modeling of the opioid epidemic and homelessness, including links to HIV, hepatitis C virus, and other communicable diseases along with model-based evaluations of the health and
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. South Carolina Retirement Yes State Insurance Programs Yes Annual Leave Yes Sick Leave Yes Position Description Advertised Job Summary Conduct advanced research in the modeling, simulation, and analysis
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Engineer will conduct R&D in nuclear nonproliferation with expertise in computational nuclear reactor physics through modeling and simulation (M&S). The candidate will perform analysis and methods
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05.07.2026, Academic staff Our research combines mathematical modeling, numerical simulation, scientific computing, and data-driven methodologies to improve the predictive capabilities and
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, preferably related to serious games and/or agent-based modeling and simulation Desired experience: 2 to 5 years of professional experience Where to apply Website https://www.aplitrak.com/?adid
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Postdoc (f/m/d) Methods Development for the Micromechanical Characterization and Modeling of the ...
., finite element simulation, crystal plasticity modeling, analytical/semi-empirical hardening models, or data-driven analysis methods, along with a demonstrated ability to independently develop new
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, addressing practical challenges in flow distribution, heat and mass transfer, sealing, reproducibility and stable operation. Translate device concepts into CAD models and engineering drawings, and coordinate
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experimentation, advanced metallurgical characterization, and computational modeling for quantification of materials properties related to weldability and printability, and for alloy development and compositional