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joining technologies, motor winding arrangements, and 3D-printed structures capable of mounting semiconductor devices within the motor architecture. 2. Thermal Management The harsh thermal environment
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, motor winding arrangements, and 3D-printed structures capable of mounting semiconductor devices within the motor architecture. 2. Thermal Management The harsh thermal environment within integrated motor
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A PhD studentship is available for commencement October 2026 – January 2027 as part of the first Cohort of a new EPSRC Centre for Doctoral Training in UK Semiconductor Industry Future Skills* led by
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. Theory and modelling of EIT and four-wave mixing will guide the experiments, alongside group work on nanophotonic design. The student will work across device fabrication, cryogenic QD optics and atomic
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-assisted discovery and development of semiconductor materials and devices. This exciting new field will lead to new types of quantum computers, new lasers increasing the speed of the internet, electronics
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between excited electronic states and the wildly vibrating atoms in these “soft semiconductors”. This can lead to the trapping of charge carriers and excitons (bound electron-hole pairs), shifted and
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Electronics, will use computational simulations to study how thin films form during flowable chemical vapor deposition (FCVD), a process used to build advanced semiconductor devices. Unlike traditional CVD