Sort by
Refine Your Search
-
Listed
-
Category
-
Country
-
Program
-
Employer
- Fraunhofer-Gesellschaft
- NIST
- North Carolina State University
- Argonne
- Nanyang Technological University
- National University of Singapore
- Delft University of Technology (TU Delft)
- Indiana University
- University of Southern California
- ;
- European Space Agency
- Purdue University
- THE UNIVERSITY OF HONG KONG
- University of Texas at Austin
- DAAD
- ETH Zurich
- Ghent University
- McGill University
- National University of Science and Technology POLITEHNICA Bucharest
- Oak Ridge National Laboratory
- Pennsylvania State University
- Technische Universität München
- Texas A&M University System
- University of California
- University of Florida
- University of Zagreb, Faculty of Electrical Engineering and Computing
- Arizona State University
- Cornell University
- Eindhoven University of Technology (TU/e)
- Great Bay University
- Grenoble INP - Institute of Engineering
- Helmholtz Association of German Research Centres
- Huazhong Agricultural University (HZAU)
- Iowa State University
- King Abdullah University of Science and Technology
- Marquette University
- Massachusetts Institute of Technology
- NIST Nanostructure Fabrication and Measurement Group
- National Aeronautics and Space Administration (NASA)
- Rochester Institute of Technology
- SINGAPORE INSTITUTE OF TECHNOLOGY (SIT)
- SciLifeLab
- Stony Brook University
- Technical University of Denmark;
- Technical University of Munich
- The Ohio State University
- University College Cork
- University of Bath
- University of Bremen •
- University of British Columbia
- University of Connecticut
- University of Copenhagen
- University of Delaware
- University of Glasgow
- University of Illinois at Urbana Champaign
- University of Liverpool
- University of Salford;
- University of Sheffield
- University of South-Eastern Norway
- University of Sydney
- University of Twente
- University of Twente (UT)
- Universität Stuttgart
- Virginia Tech
- 54 more »
- « less
-
Field
-
Posting Details Position Details Title Multiple Tenured Associate or Full Professors in Microelectronics, Circuits, and Systems Design Appointment Status Tenure Department IU Bloomington Vice
-
Multiple Tenure-Track Assistant Professor Positions in Microelectronics, Circuits and Systems Design
and Rank Special Instructions This search is running concurrently with a tenured, associate or full professor search in Microelectronics. For more information see: https://indiana.peopleadmin.com
-
Location ESTEC, Noordwijk, Netherlands Our team and mission The Radiation and Component Reliability Section (TEC-EDR) and the Microelectronics Section (TEC-EDM) are part of the Avionics and EEE
-
Job Posting Title: Equipment Engineer, Deposition and Thermal Process Development, Microelectronics Research Center ---- Hiring Department: Office of the Vice President for Research ---- Position
-
RAP opportunity at National Institute of Standards and Technology NIST Microwave Materials for High-Speed Microelectronics Location Communications Technology Laboratory, Radio Frequency
-
2 Sep 2026 Job Information Organisation/Company University of Zagreb, Faculty of Electrical Engineering and Computing Department Department of Electronics, Microelectronics, Computer and Intelligent
-
, staff and students share their knowledge, expertise and resources with residents in every corner of the state through public service and outreach programs. The Illinois Quantum and Microelectronics Park
-
MultiPhysics Measurements and Modeling for Microelectronics at Microwave and mm-Wave Frequencies NIST only participates in the February and August reviews. Performance, security, and reliability
-
Postdoctoral Research Associate- AI/ML Accelerated Theory Modeling & Simulation for Microelectronics
, Northwestern University, and Lawrence Berkeley National Laboratory to address grand challenge problems in materials for next-generation microelectronics applications. The position resides in the Theory
-
to develop advanced technologies in the field of microelectronics, particularly for automotive applications. The project focuses on the design, development and testing of innovative electronic structures based