12 antenna "Fraunhofer Gesellschaft" positions

Research Engineer* / Research Scientist* for High-Frequency Design

-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and

Student assistant / Thesis - Quantum electronics

Fraunhofer FHR in Wachtberg near Bonn is part of the large Fraunhofer-Gesellschaft and one of the leading and largest European research institutes in the field of high-frequency physics and radar

Research Associate (m/f/d) in mmWave RF IC design for radar-based sensor modules

experience with production environments and processes in clean room fabrication, and in antenna design as well as in passive RF devices and structures High motivation and ability to quickly familiarise with

Research Engineer* / Research Scientist* for Development of Radar Systems

-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and

Student Assistant - Antenna Design

-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and

Bachelor/Master thesis or student assistant in the field of antenna design

-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and

Bachelor/Master thesis - Antenna Design

-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and

Bachelor/Master thesis - High-Frequency Design

-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and

Student Assistant - High-Frequency Design

-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and

Scientist 6G Standardization

of interest are: MIMO, massive antenna systems, millimeter wave technologies and related protocol signaling aspects, reconfigurable intelligent surface (RIS), or cell-free MIMO AI-ML applied to the above