14 communication-engineering-"https:" "https:" "https:" "https:" "https:" "OSU" positions at CEA
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representative tests in small-scale batteries. A multidisciplinary team is involved in the project with much excellence and expertise in the topic. An example of a recent related research can be found here: https
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to several publications describing the morphological changes in microalgae in different abiotic and biotic conditions (Uwizeye et al. 2021, PNAS, PMID:34215695; Uwizeye et al. 2020, Nat. Commun, PMID:33594064
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We are looking for a co-design engineer for future computing architectures in HPC. This position, in a fixed-term contract, is based at the Nano-Innov site of Paris-Saclay, Essonne (91). As part of
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field modeling of brittle fracture: Part I—Theory and simulations, Journal of the Mechanics and Physics of Solids, Volume 121, 2018, Pages 81-98, https://doi.org/10.1016/j.jmps.2018.07.010. [2] Lamia
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. The postdoctoral researcher will join the DAp’s SVOM scientific team and collaborate broadly with the international scientific community involved in the mission. SVOM data are accessible to all collaboration members
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analysis with controlled experiments on language models, to: What do we expect from you? Measure what low-rank preparation does to a model's compressibility, by factorization and by quantization, against
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an innovative technology through the complete development process: Physical modelling → CFD simulation → prototype development → experimental validation → scientific publications and technological innovation
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profile: Student in the final year of engineering school or Master 2 Desired skills: A strong motivation to learn and contribute to research in artificial intelligence. In-depth knowledge
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physics, microwave engineering, electrical engineering, physics or a closely related field. The ideal candidate will have: A solid background in plasma physics and/or microwave diagnostics; Experience in
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project is to achieve the integration of quantum devices within Fully Depleted Silicon-On-Insulator (FD-SOI) technology on a 300 mm platform. The success of this integration critically depends