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Field
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the charge as the recipient of a $39.4 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap
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: Quantum science and technology Microelectronics Sensing Energy conversion and storage Considerable experience in designing and implementing novel nanotechnologies as they relate to electron and X-ray
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of renewable energy, energy storage, and cross-border infrastructure) Artificial intelligence and digitalization, as well as microelectronics (e.g., strengthening Europe’s digital sovereignty, research on AI
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attacks on QKD sources or single-photon detectors. Experience with microelectronics, fast signal processing, and circuit design, including FPGA-based control, real-time acquisition, and hardware description
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leading the charge as the recipient of a >$78 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap
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leading the charge as the recipient of a >$78 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap
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breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices. Our Impact Backed by $1.4 billion in combined funding from
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, as well as microelectronics (e.g., strengthening Europe’s digital sovereignty, research on AI applications, ethical standards, and cybersecurity; research on innovative, AI-enabled chip applications
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on Microelectronics and MEMS. Microelectronics and MEMS systems is a major research thrust that supports and further strengthens other existing Opus College of Engineering research areas including smart sensors systems
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Imaging Microsystem Technology Microelectronics Intelligent Devices and Systems Advanced Semiconductor Materials & Devices Ultrafast Systems Bendable Electronics and Sensing Technologies More information