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Helmholtz-Zentrum Dresden-Rossendorf - HZDR - Helmholtz Association | Dresden, Sachsen | Germany | 2 months ago
fracture approaches # Documentation, analysis and publication of results in peer-reviewed journals and at international conferences Your profile # Completed PhD in Materials Science, Physics, Materials
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APPLICATION INSTRUCTIONS: CURRENT PENN STATE EMPLOYEE (faculty, staff, technical service, or student), please login to Workday to complete the internal application process . Please do not apply
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1 Oct 2026 Job Information Organisation/Company NEW YORK UNIVERSITY ABU DHABI Research Field Engineering Researcher Profile Recognised Researcher (R2) Established Researcher (R3) Application
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Requirements Research FieldEngineering » Materials engineeringEducation LevelPhD or equivalent Skills/Qualifications The candidate must hold a PhD, ideally in materials science, eco-design or process engineering
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Description The Division of Engineering at New York University Abu Dhabi seeks to recruit a motivated Post-Doctoral Associate to conduct research in structural mechanics under the supervision
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Vacancies Post-doctoral position in Experimental Analysis and Control of Induction Welding Process for Thermoplastic Composites of Thermoplastic Manufacturing Process Key takeaways The challenge
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Engineer will conduct R&D in nuclear nonproliferation with expertise in computational nuclear reactor physics through modeling and simulation (M&S). The candidate will perform analysis and methods
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Join TU Delft to uncover the biology of cellular robustness in an industrial yeast process and translate your discoveries into innovative genome engineering strategies. Job description You will join
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chemical process design to advance sustainable technologies Base Salary $113,634 - $125,896 + 17% superannuation About the opportunity The School of Chemical and Biomolecular Engineering at the University
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked