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Chemistry, Materials Science, Electrical Engineering or Physics. Experience and knowledge in one or more of the following areas are considered as merits: Research background in thin-film device fabrication
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research group : The incumbent will join the Air Quality Research Lab (https://www.jun-meng.com/) led by Dr. Jun Meng, Assistant Professor in the Department of Civil and Environmental Engineering. The
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Centers: Otolaryngology, Head & Neck Surgery Appointment Start Date: ASAP Group or Departmental Website: https://med.stanford.edu/valdez-lab.html (link is external) How to Submit Application
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, electrochemical and enzymatic reaction engineering, mechanistic investigation, and reactor-level performance optimization. The work may include electrocatalyst and enzyme immobilization, electrochemical
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and aggregation. The applied methods include protein engineering as well as various spectroscopy, scattering, biosensing and microfluidics techniques. We work on a range of protein systems the
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The School of Materials Science and Engineering (MSE) provides a vibrant and nurturing environment for staff and students to carry out inter-disciplinary research in key areas such as Computational
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( https://www.usnews.com/education/best-global-universities/rankings ). The College of Engineering and the ME Department foster a highly collegial and collaborative culture. The University of Washington
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Associates to lead methodological innovation, software architecture engineering, and scientific execution across its active grant portfolio. Working under the direct mentorship of Dr. Hongfang Liu and lab
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King Abdullah University of Science and Technology | Saudi Arabia, | Saudi Arabia | about 20 hours ago
King Abdullah University of Science and Technology: Postdoc Positions: Physical Science and Engineering Division (postdoc): Material Science and Engineering (postdoc) Location King Abdullah
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programs. MINIMUM QUALIFICATIONS: • PhD in Electrical and Computer Engineering, Mechanical Engineering, Physics, or a closely related field. • Demonstrated expertise in MEMS/NEMS design and modeling