Sort by
Refine Your Search
-
Country
-
Employer
- Argonne
- Cornell University
- Pennsylvania State University
- Biophysical and Biomedical Measurement Group - NIST
- Biophysical and Biomedical Measurement Group, National Institute of Standards and Technology
- DAAD
- George Washington University
- Iowa State University
- King Abdullah University of Science and Technology
- Oak Ridge National Laboratory
- SciLifeLab
- Technical University of Munich
- University of California
- University of Southern California
- 4 more »
- « less
-
Field
-
Postdoctoral Research Associate- AI/ML Accelerated Theory Modeling & Simulation for Microelectronics
, Northwestern University, and Lawrence Berkeley National Laboratory to address grand challenge problems in materials for next-generation microelectronics applications. The position resides in the Theory
-
for next-generation information processing, microelectronics, wireless communication, and quantum information science. Key Responsibilities: Develop terahertz coplanar resonators, including design
-
, the broader USC research ecosystem, and fabrication routing through the CA DREAMS Microelectronics Commons Hub. Direct involvement in a high-visibility DARPA program with clear paths to first-author
-
collaboration with researchers from Argonne National Lab and Oak Ridge National Lab on a collaborative Department of Energy funded project “AlphaFold for Microelectronics”. The role will be to develop data
-
Biophysical and Biomedical Measurement Group - NIST | Gaithersburg, Maryland | United States | 26 days ago
or applying them. Group information: https://www.nist.gov/pml/microsystems-and-nanotechnology-division/biophysical-and-biomedical-measurement-group Related publication: Single-Molecule Biodosimetry Analytical
-
candidate will contribute to three cutting-edge research programs funded by DARPA. These projects span advanced microsystems, novel computing paradigms, and next-generation intelligent hardware; offering a
-
, cybersecurity, microelectronics, and systems and controls. Faculty and researchers collaborate with industry, government agencies, and national laboratories to develop solutions that address pressing
-
. The successful candidate will contribute to three cutting-edge research programs funded by DARPA. These projects span advanced microsystems, novel computing paradigms, and next-generation intelligent hardware
-
, and thermal engineers will collaborate to develop the next generation of microelectronics manufacturing. Requirements Applicants must have a PhD in electrical engineering by the start date with a strong
-
microelectronics. More information about our research can be found on: High-Speed Integrated Circuits Lab – Professor Wooram Lee Requirements Applicants must have a PhD in electrical engineering by the start date