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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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on the cutting edge of chemical technology, applied physics and biomedical technology. Our fields of application include sustainable energy, process technology and materials science, nanotechnology and technical
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date is November 2026. Interviews will take place in the week of August 24, 2026. Screening is part of the selection process. About the department You will work in the Human Media Interaction group
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Vacancies Postdoc in Sustainable Circular Business Models and Finance in Hubs for Circularity Key takeaways The Challenge As process industries transition to circular models, companies within Hubs