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Field
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Risk and Infrastructure Systems Lab, led by Asst. Prof. Alex Sixie Cao, develops quantitative methods for understanding and managing the reliability, robustness, and safety of structures and
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to develop soft, stretchable interconnect technologies for next-generation stretchable and flexible electronic devices. The role focuses on the design, fabrication, and reliability of conductive
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device function under deformation. Conduct microstructural, chemical, mechanical, and electromechanical characterization, including electrical and reliability evaluation under bending, stretching
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across the project. Evaluate the reliability of the devices and processes developed in in the project utilising and developing bending, twisting and dynamic stretch testing systems compliant with the
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Engineering, Materials Science, Applied Physics, or related field Experience in high-reliability microelectronics Familiar with micro-fabrication techniques and semiconductor processing Experience in
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reliability, and control robustness under dynamic IT workloads and environmental conditions. Qualifications • PhD degree in mechanical engineering, control engineering, energy systems, or a
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in hospitality, communication, or office environments Strong attention to detail, reliability, and critical thinking skills Comfortable talking to groups of students and professionals Proficient with
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project. Evaluate the reliability of the devices and processes developed in in the project utilising and developing bending, twisting and dynamic stretch testing systems compliant with the IPC-8981
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. While wireless technologies have become ubiquitous, they still struggle to provide the deterministic behavior, synchronization accuracy, reliability, and predictability required by these demanding
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correctness, robustness and reliability of deep neural networks and AI-enabled software systems. Job Responsibilities: Develop novel methods and algorithms for the verification, testing and