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chip packaging F5 Experience using data analysis or machine learning tools for electronics reliability or sustainability assessment F6 Experience with rapid prototyping technologies (3D printing, laser
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algorithms to improve the performance of scientific applications Researching digital and post-digital computer architectures for science Developing and advancing extreme-scale scientific data management
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application consists of: An application Transcript(s) – For this opportunity, an unofficial transcript or copy of the student academic records printed by the applicant or by academic advisors from internal
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Skip to Main Content Toggle navigation Home Search Jobs Job Alerts Log In /Create Account Help Post Doc Fellow w/Ret Bookmark this Posting Print Preview | Apply for this Job Please see Special