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microfabrication, functional soft materials, and bioactive delivery systems. The role will focus on developing micro/nanostructured material platforms for controlled release, biological screening
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optical microscopy) and biochemical analytical methodologies (e.g. micro-FTIR, micro-XRD, micro-MRI, micro-CT, synchrotron-based Xray fluorescent microscopy, and so on) Bio-sample preparation Literature
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characterization. We are looking for a Research Associate / Research Fellow to support micro device research and development work. The role will work closely with the project team on the full spectrum of project
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microfluidic devices Materials Science and Chemistry Experience: Experienced in wet laboratory techniques, particularly in fabrication techniques for functional materials in micro- or nano- scale
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microfluidic devices Materials Science and Chemistry Experience Experienced in wet laboratory techniques, particularly in fabrication techniques for functional materials in micro- or nano- scale
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Electron Microscopy studies. Responsible for micro- and nanofabrication, process developments and improvements, device characterization. The candidate will be the link between semiconductor industry
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University of North Carolina at Charlotte | Charlotte, North Carolina | United States | about 10 hours ago
in a related field and experimental background in one or several of the following areas: fiber optics, opto-couplers, nano- and micro-material development, optical spectroscopy, and thin film
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imaging methodologies to support interdisciplinary cancer research programs, including magnetic resonance imaging (MRI), optical imaging, micro-computed tomography (micro-CT), photoacoustic imaging, and
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agreement. The position is linked to the funded project “Wear and Fracture Testing Models for Dental Crowns: From Oral Tribology to 4D Micro-CT Failure Analysis”. The laboratory-based project combines
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King Abdullah University of Science and Technology | Saudi Arabia, | Saudi Arabia | about 13 hours ago
samples. Detection scale targets: cm (10 ⁻ ² m) — Structural cracks, delamination, component failure mm (10 ⁻ ³ m) — Voids, inclusions, solder bridges, swelling µm (10 ⁻ ⁶ m) — Micro