15 multi-scale-composite-wind Fellowship positions at Hong Kong Polytechnic University
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in the research project - “Towards efficient stamp forming of thermoplastic composites through data-driven thermo-mechanical modelling”. Qualifications Applicants should have a doctoral degree or an
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from rich multimodal demonstration data; (b) conduct research on skill composition for complex long-horizon tasks; (c) develop methods for atomic skill retrieval and representation; (d) develop
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months] Duties The appointees will assist the project leader in the research project - “AIoT-powered multi-modality underwater SOS system”. Qualifications For the post of Postdoctoral Fellow, applicants
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months] Duties The appointees will assist the project leader in the research project - “Mechanisms and key technologies of multi-sensory emulation wearable devices”. Qualifications For the post of
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– “Data-driven multi-state collaborative laser wire deposition repair technology for aeroengine blades”. Qualifications Applicants should have a doctoral degree or an equivalent qualification and must have
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] Duties The appointees will assist the project leader in the research project - “Development of high-performance functionally graded materials by additive manufacturing with tailorable gradient compositions
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regulation”. The appointees will be required to: (a) develop multi-agent systems; (b) assist in recommendation, payment and regulation algorithm design; (c) provide support in experimental result
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for flexible and efficient manufacturing of micrometer/submicron-scale devices”. Qualifications For the post of Research Fellow, applicants should have a doctoral degree in Electrical, Electronic, Optical
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] Duties The appointees will assist the project leader in the research project - “SLAssistants: multi-agentic generative AI-driven smart logistics assistants for B2B cross-border multi-stage multi-modal
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The appointees will assist the project leader in the research project - “Digital ultraviolet lithography system for flexible and efficient manufacturing of micrometer/submicron-scale devices”. Qualifications