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initiative. Our Mission A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing
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DREAMS Microelectronics Commons) Key responsibilities: Maintaining EDA tool flows for tools from multiple vendors, with an emphasis on digital flows Managing cloud platform for EDA tool usage and IP
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, and mathematics. Application areas include robotics, social data science, bioinformatics, natural language processing, climate change, big data systems, communications, microelectronics and computer
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the charge as the recipient of a $39.4 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap
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: Quantum science and technology Microelectronics Sensing Energy conversion and storage Considerable experience in designing and implementing novel nanotechnologies as they relate to electron and X-ray
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of renewable energy, energy storage, and cross-border infrastructure) Artificial intelligence and digitalization, as well as microelectronics (e.g., strengthening Europe’s digital sovereignty, research on AI
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attacks on QKD sources or single-photon detectors. Experience with microelectronics, fast signal processing, and circuit design, including FPGA-based control, real-time acquisition, and hardware description
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on Microelectronics and MEMS. Microelectronics and MEMS systems is a major research thrust that supports and further strengthens other existing Opus College of Engineering research areas including smart sensors systems
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leading the charge as the recipient of a >$78 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap
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leading the charge as the recipient of a >$78 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap