76 environmental science microplastics scholarships at Eindhoven University of Technology
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Irène Curie Fellowship No Department(s) Mathematics and Computer Science Reference number V32.7364 Job description Cyber-attacks targeting human users are on the rise both in sophistication and
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Irène Curie Fellowship No Department(s) Industrial Engineering and Innovation Sciences Reference number V39.7542 Job description Are you passionate about exploring the intersection of human
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for engineers. Job requirements A master’s degree (or an equivalent university degree) in natural or technical sciences with a clear affinity towards environmental topics. A research-oriented attitude. Ability
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the steel and the cement industry. Concrete is by far the most produced material in the world, and reducing its environmental impact is a major concern. Currently granulated Blast Furnace slag from
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the future of technology! Irène Curie Fellowship No Department(s) Chemical Engineering and Chemistry Reference number V37.7434 Job description This project is to be carried out at TU/e – Eindhoven University
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buildings and infrastructure is one of society’s most critical environmental challenges since a large amount of waste, pollution, and gas emissions are produced. In the last decade, bio-based composite
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operations such as agricultural tractors? Then we have a job for you! Irène Curie Fellowship No Department(s) Electrical Engineering Reference number V36.7481 Job description In contrast to conventional
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Irène Curie Fellowship No Department(s) Industrial Engineering and Innovation Sciences Reference number V39.7441 Job description Do you have an interest in innovation, strategy, entrepreneurship
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Irène Curie Fellowship No Department(s) Industrial Engineering and Innovation Sciences Reference number V39.7299 Job description Are you interested in the development of business models for
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Irène Curie Fellowship No Department(s) Electrical Engineering Reference number V36.7293 Job description Would you like to perform cutting-edge research at the intersection between IC hardware and