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at the bio-electronics interface. Through electronic material development and nano/microfabrication innovation, we will develop next-generation electronic materials and microelectronics that mimic
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, Robotics, Microelectronics Engineering or a related discipline. Knowledge, research experience or demonstrated interest in one or more of the following areas: Robotic grippers and robotic manipulation
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, Electrical and Electronic Engineering, Computer Engineering, Physical and Mathematical Sciences or relevant disciplines Basic knowledge in microelectronics is required, and knowledge in failure analysis is a
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collaboration with researchers from Argonne National Lab and Oak Ridge National Lab on a collaborative Department of Energy funded project “AlphaFold for Microelectronics”. The role will be to develop data
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with a PhD in Experimental Physics, Electronic Engineering, Microelectronics, or a closely related discipline, together with proven expertise in ASIC design in either analogue/mixed-signal or digital
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will work at the Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS), within the Department of Microelectronics . Here, you will join an interdisciplinary research environment
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candidate will contribute to three cutting-edge research programs funded by DARPA. These projects span advanced microsystems, novel computing paradigms, and next-generation intelligent hardware; offering a
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, cybersecurity, microelectronics, and systems and controls. Faculty and researchers collaborate with industry, government agencies, and national laboratories to develop solutions that address pressing
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, and thermal engineers will collaborate to develop the next generation of microelectronics manufacturing. Requirements Applicants must have a PhD in electrical engineering by the start date with a strong
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microelectronics. More information about our research can be found on: High-Speed Integrated Circuits Lab – Professor Wooram Lee Requirements Applicants must have a PhD in electrical engineering by the start date