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, processing optimization, and experimental troubleshooting Materials characterization using techniques such as GIWAXS, Raman, FTIR, UV-vis, and electrical transport measurements Understanding structure-property
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, Sputtering or MOCVD systems for microelectronics and emerging sensor technologies. Key Responsibilities: Develop and optimize wafer-scale 2D materials, including TMDCs, MXenes, and MOFs, for microelectronics
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