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Researcher Profile First Stage Researcher (R1) Positions PhD Positions Application Deadline 2 Sep 2026 - 16:00 (Europe/Bucharest) Country Romania Type of Contract Temporary Job Status Full-time Is the job
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on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits for automotive
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structures based on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits
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on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits for automotive
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Regulations No. 155 and No. 156 regarding automotive cybersecurity; Professional and/or research experience with the AUTOSAR standard and associated automotive software architectures; Experience with
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. Knowledge of the ISO/SAE 21434 standard for automotive cybersecurity engineering. Experience with the AUTOSAR standard and associated automotive software architectures. Demonstrated experience in
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technologies is an advantage. Skills and Competencies: Knowledge of software architectures and databases / Capacity to analyze and solve technical problems / Ability to work in a multidisciplinary team / Skills
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of the ISO/SAE 21434 standard for automotive cybersecurity is considered an advantage. Knowledge of the AUTOSAR standard and associated automotive software architectures is considered an advantage