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structures based on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits
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structures based on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits
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to develop advanced technologies in the field of microelectronics, particularly for automotive applications. The project focuses on the design, development and testing of innovative electronic structures based
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to develop advanced technologies in the field of microelectronics, particularly for automotive applications. The project focuses on the design, development and testing of innovative electronic structures based
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structures based on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits