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on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits for automotive
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structures based on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits
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on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits for automotive
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on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits for automotive
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. Knowledge of the ISO/SAE 21434 standard for automotive cybersecurity engineering. Experience with the AUTOSAR standard and associated automotive software architectures. Demonstrated experience in
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of the ISO/SAE 21434 standard for automotive cybersecurity is considered an advantage. Knowledge of the AUTOSAR standard and associated automotive software architectures is considered an advantage