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on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits for automotive
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on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits for automotive
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structures based on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits
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textbook. Available at: https://toc.cryptobook.us ; 3. Paret, D. & Rebaine H. (2022). Autonomous and Connected Vehicles: Network Architectures from Legacy Networks to Automotive Ethernet. John Wiley
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. Knowledge of the ISO/SAE 21434 standard for automotive cybersecurity engineering. Experience with the AUTOSAR standard and associated automotive software architectures. Demonstrated experience in
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of Excellence in Quantum Technologies with Impact on Cybersecurity (RexQTCS CoEx). The successful candidates will contribute to research activities at the intersection of automotive cybersecurity, embedded
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technologies is an advantage. Skills and Competencies: Knowledge of software architectures and databases / Capacity to analyze and solve technical problems / Ability to work in a multidisciplinary team / Skills