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alert: Create Alert × Select how often (in days) to receive an alert: Apply now » RAMS (Reliability, Availability, Maintainability and Safety) Engineer Job Requisition ID: 20793 Date Posted: 24 July
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Apply now » Galileo Lead Space Segment Engineer (2 posts) Job Requisition ID: 20809 Date Posted: 30 July 2026 Closing Date: 4 September 2026 23:59 CET/CEST Publication: Internal & External Type of
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Apply now » Guidance, Navigation and Control (GNC) Systems Engineer Job Requisition ID: 20732 Date Posted: 2 July 2026 Closing Date: 13 August 2026 23:59 CET/CEST Publication: Internal & External
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Apply now » AOCS and Pointing Systems Engineer (3 Positions) Job Requisition ID: 20731 Date Posted: 15 September 2026 Closing Date: 29 September 2026 23:59 CET/CEST Publication Method: Internal
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15 Aug 2026 Job Information Organisation/Company ARCNL Research Field Physics » Condensed matter properties Physics » Optics Researcher Profile Recognised Researcher (R2) Application Deadline 7 Feb
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University of Amsterdam (UvA) | Amsterdam, Provincie Noord-Holland | Netherlands | about 1 month ago
4 Sep 2026 Job Information Organisation/Company University of Amsterdam (UvA) Research Field Physics » Applied physics Physics » Quantum mechanics Researcher Profile Recognised Researcher (R2
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Delft University of Technology (TU Delft) | Delft, Provincie Zuid-Holland | Netherlands | 26 days ago
embedded in a larger interdisciplinary consortium spanning polymer and composite science, nanoscience, physics, and process engineering, including partners such as Airbus, GKN, and DLR. Your research
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generative models produce data that looks plausible but violates physics and is therefore of limited use for grid planning. As a PhD candidate you will develop physics-informed, domain-constrained
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration To vacancy overview Apply now TNW PostDoc PostDoc position on Wafer Bonding Physics for 3D Chip Integration Do you want to
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration To vacancy overview Apply now TNW PostDoc PostDoc position on Wafer Bonding Physics for 3D Chip Integration Do you want to