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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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website of the Faculty of Electrical Engineering, Mathematics and Computer Science. Conditions of employment This position is offered as an Academic Career Track position (0.8 – 1.0 FTE). During
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Engineering, Radiation Science & Technology, and Engineering Physics. We are also training the next generation of high school teachers. Click here to go to the website of the Faculty of Applied Sciences
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last year, are at a similar stage of their research journey. The current group has a mixed BSc/MSc background, ranging from computer science to physics, electrical engineering and mathematics. Here
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of heterogeneous integration and advanced device transfer technologies. Information Photonic integrated circuits - or optical chips - have evolved into a mature technology with a broad spectrum of use cases and a
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, more than 1000 employees and 4,000 students work and study in this innovative environment. Click here to go to the website of the Faculty of Electrical Engineering, Mathematics and Computer
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of the resulting performance in our MEMS measurement lab. The PhD candidate will work at the Integrated Devices and Systems (IDS) group within the Faculty of Electrical Engineering, Mathematics and Computer
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energy consumption. You will investigate the complete technology stack, including device physics, photonic and electronic design, modelling, chip layout, cleanroom fabrication, heterogeneous integration
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Division (TEC-ED) in the Electrical Department (TEC-E). Their main area of responsibility is to provide direct and indirect engineering support to ESA projects and European industry in the fields of EEE
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18 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Physics » Quantum mechanics Researcher Profile Recognised Researcher (R2) Application