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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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scientifically challenging and industrially relevant topic, with the aiming at predictive relations between measurable wafer surface properties and bonding performance for next-generation 3D chip integration
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data, prepare high-impact scientific manuscripts, and present findings at major international conferences. Project Leadership & Mentorship: Actively contribute to project management within the ERC
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set of synthetic and spectroscopic tools that connect molecular structure and organization, their properties and function. This is what you are going to do Design and build flow setups using 3D printer
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what you are going to do Design and build flow setups using 3D printer, pumps, valves operated by a computer and the corresponding software Develop flow cells to connect various spectroscopic tools
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antigens presented by MHC molecules. This curiosity-driven project develops cutting-edge AI technology for 3D TCR–pMHC modeling to improve neoantigen identification, TCR specificity prediction, and TCR
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scientifically challenging and industrially relevant topic, with the aiming at predictive relations between measurable wafer surface properties and bonding performance for next-generation 3D chip integration
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brittle minerals into tough materials, like the nacre in seashells, by combining them with soft organic polymers. In this project, we explore a fundamentally different approach. Using 3D-printed concrete as
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that aims at transforming flow field measurements into aerodynamic forces by pressure and friction. Job description The Aerodynamics group is composed of 12 scientific staff and hosts the Chairs
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. Job description The Aerodynamics group is composed of 12 scientific staff and hosts the Chairs of Experimental Aerodynamics, Computational Fluid Dynamics and Flow Control. The group has a specific