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10 Oct 2026 Job Information Organisation/Company University of Amsterdam (UvA) Research Field Language sciences » Languages Language sciences » Linguistics Researcher Profile Recognised Researcher
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2 Oct 2026 Job Information Organisation/Company Leiden University Research Field Language sciences » Linguistics Researcher Profile Recognised Researcher (R2) Application Deadline 1 Nov 2026 - 22:59
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Job description In the context of a NWO-KIC grant “Materials for defense
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the box and explore new avenues, with natural curiosity and a passion for new subjects and research areas; experience with one or more general-purpose programming languages, for example Python and general
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the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Can advanced
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and computer programming (e.g. Python); strong communication and scientific writing skills in English. Helpful criteria: experience with Dynamic Adaptive Pathways Planning or other methods from Decision
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) Application Deadline 1 Nov 2026 - 22:59 (UTC) Country Netherlands Type of Contract Temporary Job Status Not Applicable Hours Per Week 40.0 Is the job funded through the EU Research Framework Programme? Not
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Not Applicable Hours Per Week 34.2 Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No
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2026 - 21:59 (UTC) Country Netherlands Type of Contract Temporary Job Status Not Applicable Hours Per Week 19.0 Is the job funded through the EU Research Framework Programme? Not funded by a EU programme
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip