260 Computer Science "Data driven Materials Modeling" Postdoctoral positions in Netherlands
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high-tech industries. Research is organized into four themes: Analytical Chemistry , Computational Chemistry , Synthesis & Catalysis and Molecular Photonics . The Faculty of Science has a student body
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-generation technologies for understanding and managing the subsurface. This position is embedded within the national Sectorplan Earth and Environmental Sciences (AMW) programme and contributes to strategic
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27 Sep 2026 Job Information Organisation/Company University of Amsterdam (UvA) Research Field Communication sciences » Science communication Medical sciences » Medicine Researcher Profile Recognised
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collaboration with the Department of Advanced Computer Science and the Sensor Engineering group, creating a highly interdisciplinary research environment at the intersection of plant science, engineering, and
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23 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Maritime engineering Engineering » Mechanical engineering Researcher Profile
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Computer Science The Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) brings together three scientific disciplines. Combined, they reinforce each other and are the driving force
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27 Sep 2026 Job Information Organisation/Company University of Amsterdam (UvA) Research Field Medical sciences » Medicine Researcher Profile Recognised Researcher (R2) Application Deadline 15 Oct
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for the Protection of Systems and Information (EIPSI), in the department of Mathematics and Computer Science. The work is carried out in collaboration with QUANT at Twente University and QSA Technology, as well as TU
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Biological sciences » Biology Computer science » Informatics Computer science » Programming Researcher Profile Recognised Researcher (R2) Application Deadline 16 Oct 2026 - 21:59 (UTC) Country Netherlands Type
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip