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collaboration with the Department of Advanced Computer Science and the Sensor Engineering group, creating a highly interdisciplinary research environment at the intersection of plant science, engineering, and
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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circuits contribute to pathological aggression. The postdoc will use functional ultrasound imaging, behavioural assays, physiological recordings, computational modelling, and pathway-selective chemogenetic
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imaging applications. The researcher will work in an interdisciplinary MRI research environment and collaborate closely with researchers in MR physics, engineering, and biomedical imaging. The position
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8 Aug 2026 Job Information Organisation/Company Utrecht University Research Field Communication sciences » Journalism Computer science » Informatics Researcher Profile Recognised Researcher (R2
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Computer Science The Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) brings together three scientific disciplines. Combined, they reinforce each other and are the driving force
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18 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Physics » Quantum mechanics Researcher Profile Recognised Researcher (R2) Application
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21 Jul 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Computer science » Programming Engineering » Biomedical engineering Researcher Profile
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4 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Biomaterial engineering Engineering » Chemical engineering Researcher Profile
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, Weindel, van Maanen, & Borst, Imaging Neuroscience, 2024, and Den Otter, Weindel, Stuit, Van Maanen, Plos Computational Biology, 2026 for more information about these methods. The goal of the project is to