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–3rd December (first round) and 10th–11th December (second round), held online. You can address your application to Dr James Hutton Please note: You can apply online. We will not process applications
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-generation 3D chip integration. Where to apply Website https://www.academictransfer.com/en/jobs/364047/postdoc-position-on-wafer-bondi… Requirements Specific Requirements You have a PhD degree in materials
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Engineering, Civil Engineering, Computer Science, Data Science, Applied Mathematics, or a closely related quantitative field. You love physics and complex systems and are either familiar with, or very eager
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University of Technology, Eindhoven University of Technology, TNO‐BMC, Toray Advanced Composites, TPRC, University of Twente, University of Warwick, and Victrex). Where to apply Website https
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will be asked to provide contact information of at least 3 references. Please note: You can apply online. We will not process applications sent by email and/or post. As part of knowledge security, TU
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subject, such as aerospace engineering, aeronatucial engineering, atmospheric sciences, or (applied) physics. Excellent lab-experiences Advanced mathematical, analytical skills, and programming skills, e.g
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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Can technology learn to listen to how athletes feel, and not just to what the sensors measured? In the ASPIRE project, we develop knowledge for the new generation of sports tracking technology that
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Vacancies PostDoc Research Position on Developing Technology for Subjective Sporting Experiences Key takeaways Can technology learn to listen to how athletes feel, and not just to what the sensors
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in Condensed Matter Physics, Nanoscience or Nanotechnology, or Electrical engineering. Experience is required in one or more of the fields listed above, gained in academic research projects. What we