155 professor-computer-science-"https:"-"https:"-"https:"-"https:" Postdoctoral positions in Netherlands
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Engineering, Civil Engineering, Computer Science, Data Science, Applied Mathematics, or a closely related quantitative field. You love physics and complex systems and are either familiar with, or very eager
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for the teaching and research programme in Special Education and Youth Care. Both units are part of the Department of Pedagogical and Educational Sciences and collaborate closely in both research and education. The
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Eindhoven University of Technology invites applications for a postdoctoral research position within the recently NRO-funded project AI as a Social Agent to Support Group Learning Processes (CLARA
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thermal energy storage using a combination of molecular dynamics and process-scale simulations. By linking molecular-level understanding to engineering-scale performance, you will contribute
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for accountability, transparency, inclusiveness, and misinformation. The key technology is multimodal deep learning, and its extensions for these additional targets. In particular, we have a large collection of
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HyCARB , a national programme funded by the National Growth Fund via GroenvermogenNL that unites 45 Dutch knowledge institutions and companies to build the technology base for carbon-based chemistry from
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stack engineering in this system. Acid-base flow batteries are based on dissociating water into acid and base during charging, using bipolar membranes, and recombining acid and base in this membrane
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Fixed-term contract: 1 yr + 2 yr. What do we offer? You will be joining a highly collaborative neuroscience research environment and benefit from state-of-the-art infrastructure. The Kole group is renowned for their fundamental cellular neuron-glia studies of myelinated and axons. We have new...
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Mediterranean-wide setting. Your qualities Knowledge, skills and experience: A PhD (awarded or in the final stages of completion) in sustainability science, urban planning and governance, human geography, policy
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked