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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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collaboration with the Department of Advanced Computer Science and the Sensor Engineering group, creating a highly interdisciplinary research environment at the intersection of plant science, engineering, and
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through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Work Activities This experiment-oriented
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scientific activities in support of ESA science-related activities. You are encouraged to visit the ESA website (http://science.esa.int ) for an overview of ESA’s Science Programme. Field(s) of activity
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Deadline 16 Oct 2026 - 21:59 (UTC) Country Netherlands Type of Contract Temporary Job Status Not Applicable Hours Per Week 36.0 Is the job funded through the EU Research Framework Programme? Not funded by a
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Deadline 15 Oct 2026 - 21:59 (UTC) Country Netherlands Type of Contract Temporary Job Status Not Applicable Hours Per Week 38.0 Is the job funded through the EU Research Framework Programme? Not funded by a
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) Application Deadline 14 Oct 2026 - 21:59 (UTC) Country Netherlands Type of Contract Temporary Job Status Not Applicable Is the job funded through the EU Research Framework Programme? Not funded by a EU
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Computer Science The Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) brings together three scientific disciplines. Combined, they reinforce each other and are the driving force
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19 Sep 2026 Job Information Organisation/Company Utrecht University Research Field Agricultural sciences » Phytotechny Agricultural sciences » Soil science Biological sciences » Biodiversity
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description How to best incorporate New Genomic Techniques to solve challenging issues