19 process-engineer-"https:"-"https:"-"https:"-"https:"-"https:"-"https:" ";" Postdoctoral positions at University of Twente in Netherlands
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Vacancies Post-doctoral position in Experimental Analysis and Control of Induction Welding Process for Thermoplastic Composites of Thermoplastic Manufacturing Process To vacancy overview Apply now ET
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Postdoctoral researcher (17 months): Ethics and Epistemology of LLMs4EU: Design, Data and Deployment
part of the EU project LLMs4EU - Large Language Models for the European Union. https://www.llms4eu.eu/ Apply now Hi! Are you my new colleague? Henk Pol Hi! Are you my new colleague? Hannie Lensink Hi
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| Department MS3](https://www.utwente.nl/en/et/ms3/research-chairs/ed/)) group, Faculty of Engineering Technology at the University of Twente, The Netherlands has an opening for a postdoc candidate
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and customer-side assets for UTOPYS Help build the model library at the heart of [UTOPYS](https://www.utwente.nl/en/about-us/news-events-ceremonies/news/2025/11/663582/nwo-grant-for-installation-of
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scientists, who will together investigate and advance the fluid mechanics, the resin formulation, the mechanical properties, and process integration during Direct Bubble Writing. This novel additive
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engineer. Various teaching activities in your field of expertise may take up to 20% of your time. Your profile You are highly motivated and an enthusiastic researcher. You have an MSc degree in
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the vacancy in Dutch. Cookies We use cookies and similar technologies to process your personal data (e.g. IP address) for personalised content, ads and third-party media integrations. Functional and
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and your supervisors will determine a plan for a suitable education and supervision. Information and application Selection process: Please submit your online application before 20th August 2026 for
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detailed physics behind wafer bonding. The project combines surface science, advanced metrology, and semiconductor process development in close collaboration with industry. Apply now Hi! Are you my new
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detailed physics behind wafer bonding. The project combines surface science, advanced metrology, and semiconductor process development in close collaboration with industry. Apply now Hi! Are you my new