18 computer-science-"https:" "https:" "https:" "https:" "https:" "https:" "OSU" Postdoctoral positions at University of Twente in Netherlands
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Postdoctoral researcher (17 months): Ethics and Epistemology of LLMs4EU: Design, Data and Deployment
-Design). Your profile PhD in a relevant field (ethics, philosophy of science, philosophy of science in practice, science and technology studies, ethics of AI, or related domains such as computer
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Engineering, Mathematics and Computer Science (EEMCS) uses mathematics, electronics and computer technology to contribute to the development of Information and Communication Technology (ICT). With ICT
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| Department MS3](https://www.utwente.nl/en/et/ms3/research-chairs/ed/)) group, Faculty of Engineering Technology at the University of Twente, The Netherlands has an opening for a postdoc candidate
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, Mathematics and Computer Science (EEMCS) and the Interaction Design group at the faculty of Engineering Technology of the University of Twente, in close collaboration with Saarland University. The
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candidate working on polyvocal knowledge representation, curators, museum professionals, and other partners in the Hybrid Intelligence network. Your profile A PhD in computer science, artificial
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electrical engineering, computer science or a closely related field. A solid foundation in computer vision, pattern recognition, AI-related techniques. Hands-on interest in designing methods using
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is part of the Faculty of Electrical Engineering, Mathematics, and Computer Science. The research group studies electronic and electromechanical components and develops new concepts for nanoscale
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-wide collaborations such as the TechMed Centre and the Design Lab About the organisation The faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) uses mathematics, electronics
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systems remains a major challenge across physics, chemistry, biophysics, and materials science. In this PhD project, you will: § Develop an experimental platform to study 3D self-organization of active
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detailed physics behind wafer bonding. The project combines surface science, advanced metrology, and semiconductor process development in close collaboration with industry. Apply now Hi! Are you my new