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Are you passionate about human movement and developing clinical tools for understanding human movement disorders? Job description Challenge: Over a quarter of a million people in the Netherlands alone have rheumatoid arthritis (RA) with a majority suffering from debilitating pain and...
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Research Framework Programme? Horizon Europe Is the Job related to staff position within a Research Infrastructure? No Offer Description Build the next generation of railway track health assessment. Job
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Build the next generation of railway track health assessment. Job description Railway bridges and the tracks they support are critical components of the railway network, directly affecting safety
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beam (FIB) imaging - can be combined with AI to reconstruct nanoscale chip structures and infer functional behaviour from physical layouts. The project addresses the challenge of extracting reliable
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(PEM), and focused ion beam (FIB) imaging - can be combined with AI to reconstruct nanoscale chip structures and infer functional behaviour from physical layouts. The project addresses the challenge
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investigation, one may aim to infer hidden geological or physical structures from measurements such as seismic, electromagnetic, or other indirect observations. Similar challenges also arise in climate and
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infer the composition of subsurface oceans, by recognising and characterising icy grains that are originate directly from the ocean, which is an important step until lander missions, for instance such as
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-efficient intelligent photonic sensors. You will be part of the Photonic Integration (PhI) group at TU/e, which has a long track record of setting pioneering results in indium phosphide (InP) based photonic
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attacks and secure implementations. Weekly supervision meetings to help you stay on track. Guidance on writing, presentation, and career development. Flexible working hours. A shared interest in producing
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the project, you will develop and optimize printable materials and fabrication processes for creating conductive tracks, electrodes and other electronic components within soft 3D structures. You will