118 computer-engineering "https:" "https:" "https:" "https:" "https:" research jobs in Netherlands
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10 Oct 2026 Job Information Organisation/Company Tilburg University Research Field Sociology » Social shaping of technology Sociology » Societal behaviour Communication sciences » Media studies
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7 Oct 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Biomedical engineering Researcher Profile Recognised Researcher (R2
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University of Technology, Eindhoven University of Technology, TNO‐BMC, Toray Advanced Composites, TPRC, University of Twente, University of Warwick, and Victrex). Where to apply Website https
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shaping of technology Sociology » Societal behaviour Researcher Profile Recognised Researcher (R2) Application Deadline 21 Oct 2026 - 22:00 (UTC) Country Netherlands Type of Contract Temporary Job Status
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18 Sep 2026 Job Information Organisation/Company University of Groningen Research Field Engineering » Control engineering Engineering » Systems engineering Researcher Profile Recognised Researcher
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international community of professionals and students. Together, we create knowledge, innovations, and solutions that help move the world forward. Faculty of Electrical Engineering, Mathematics and Computer
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1 Oct 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Materials engineering Engineering » Nuclear engineering Researcher Profile
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2 Oct 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Philosophy » Epistemology Philosophy » Ethics Researcher Profile Recognised Researcher (R2
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23 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Computer science » Programming Engineering » Electrical engineering Engineering » Mechanical
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip