33 electrical-"https:" "https:" "https:" "https:" "https:" "DIFFER" Postdoctoral research jobs in Netherlands
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of shared governance challenges and strategies. The research by the PCC fits into current societal debates around ethnicity, land rights, sustainable development, female leadership and the social, economic
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requirements We are looking for applicants who have or expect to receive a PhD degree before joining the project. This positions welcomes applicants from different technical backgrounds. For example, you have
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23 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Computer science » Programming Engineering » Electrical engineering Engineering » Mechanical
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together: the backbone defines the interfaces, and your models make it realistic. Where and with whom You will join the Intelligent Electrical Power Grids (IEPG) section and work alongside the UTOPYS
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the reference in the nuclear industry, but the current fleet of reactors will reach in a few years the end of their operating licenses. Generation IV reactors, among which the Molten Salt Reactor (MSR
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farming systems, agricultural policy and/or sustainable finance. You are familiar with current policy debates on the future of European and Dutch agriculture and enjoy working at the interface of science
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the films respond to external perturbations, such as molecular guests, light or charge. The focus will be on organic cages thin films as the key material class. The broader goal is to create robust, automated
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12 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Electrical engineering Researcher Profile Recognised Researcher (R2
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forums such as the Inter-Agency Space Debris Coordination Committee (IADC) and standardisation bodies such as ECSS and ISO. You are encouraged to visit the ESA website: https://www.esa.int/ Field(s) of
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to heterogeneous integration based on silicon substrates. This approach combines the strengths of different materials within a single PIC platform. In particular, enhancing silicon platforms with efficient III-V