15 process-engineering "https:" "https:" "https:" "https:" "https:" "EMBL" Postdoctoral research jobs at University of Twente in Netherlands
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PostDoc Post-doctoral position in Experimental Analysis and Control of Induction Welding Process for Thermoplastic Composites of Thermoplastic Manufacturing Process The research group of Engineering
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Postdoctoral researcher (17 months): Ethics and Epistemology of LLMs4EU: Design, Data and Deployment
part of the EU project LLMs4EU - Large Language Models for the European Union. https://www.llms4eu.eu/ Apply now Hi! Are you my new colleague? Henk Pol Hi! Are you my new colleague? Hannie Lensink Hi
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and customer-side assets for UTOPYS Help build the model library at the heart of [UTOPYS](https://www.utwente.nl/en/about-us/news-events-ceremonies/news/2025/11/663582/nwo-grant-for-installation-of
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scientists, who will together investigate and advance the fluid mechanics, the resin formulation, the mechanical properties, and process integration during Direct Bubble Writing. This novel additive
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of Twente, Faculty ITC, wishes to increase the number of women in the faculty to have a more balanced staff profile. During all phases of the selection process, we will therefore prioritize selecting
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Transitions Partnership (DUT). The successful applicant will join the Interaction Design Research Group in the Department of Design, Production and Management, Faculty of Engineering Technology, University of
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science, device engineering, and cell therapeutic strategies towards real-world applications ? We offer an impactful postdoc position in the Leijten Laboratory within the Department of BioEngineering
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. Candidates with an MSc in Chemical Engineering, Materials Engineering, or Mechanical Engineering are also welcome to apply, particularly if their thesis work involved soft matter . Experimental Skills
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August 24, 2026. Screening is part of the selection process. Apply now Share this vacancy About the department You will work in the Human Media Interaction group at the faculty of Electrical Engineering
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detailed physics behind wafer bonding. The project combines surface science, advanced metrology, and semiconductor process development in close collaboration with industry. Apply now Hi! Are you my new