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rely on 3D Mechatronic Integrated Devices (3D-MID) to reduce wiring, weight and bulkiness. More advanced 3D-MID components also contain embedded active devices such as multi-modal sensors and
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of the project 5. Demonstrate enthusiasm in preparing articles for highly ranked journals, collaborative activities, and promoting staff in the Centre developments. Employment conditions: 1. Full-time position
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Groups of the project 5. Demonstrate enthusiasm in preparing articles for highly ranked journals, collaborative activities, and promoting staff in the Centre developments. Employment conditions: 1. Full
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